CVE-2019-2275 - Vulnerability Details

While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

No CVSS v4.0

Attack Vector Local

Attack Complexity Low

Privileges Required Low

Scope Unchanged

Confidentiality Impact High

Integrity Impact None

Availability Impact None

User Interaction None

No CVSS v3.0

Access Vector Local

Access Complexity Low

Authentication None

Confidentiality Impact Partial

Integrity Impact None

Availability Impact None

This CVE is not in the KEV list.

The EPSS score is 0.00047.

Key SSVC decision points have not yet been added.

Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).

Vendor Product Default status Versions

Qualcomm, Inc.

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

affected

Version	Status	Constraints
`MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130`	affected	—

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*

Configuration 2 [-]

AND

cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:*

Configuration 3 [-]

AND

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*

Configuration 4 [-]

AND

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*

Configuration 5 [-]

AND

cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*

Configuration 6 [-]

AND

cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*

Configuration 7 [-]

AND

cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*

Configuration 8 [-]

AND

cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs404:-:*:*:*:*:*:*:*

Configuration 9 [-]

AND

cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*

Configuration 10 [-]

AND

cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qualcomm_215:-:*:*:*:*:*:*:*

Configuration 11 [-]

AND

cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*

Configuration 12 [-]

AND

cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*

Configuration 13 [-]

AND

cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*

Configuration 14 [-]

AND

cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*

Configuration 15 [-]

AND

cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*

Configuration 16 [-]

AND

cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*

Configuration 17 [-]

AND

cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*

Configuration 18 [-]

AND

cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*

Configuration 19 [-]

AND

cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*

Configuration 20 [-]

AND

cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*

Configuration 21 [-]

AND

cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*

Configuration 22 [-]

AND

cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*

Configuration 23 [-]

AND

cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*

Configuration 24 [-]

AND

cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*

Configuration 25 [-]

AND

cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*

Configuration 26 [-]

AND

cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*

Configuration 27 [-]

AND

cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*

Configuration 28 [-]

AND

cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*

Configuration 29 [-]

AND

cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*

Configuration 30 [-]

AND

cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*

Configuration 31 [-]

AND

cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*

Configuration 32 [-]

AND

cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*

Configuration 33 [-]

AND

cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*

Configuration 34 [-]

AND

cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*

Configuration 35 [-]

AND

cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*

Configuration 36 [-]

AND

cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:*

Configuration 37 [-]

AND

cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*

Configuration 38 [-]

AND

cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*

Configuration 39 [-]

AND

cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*

Configuration 40 [-]

AND

cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*

Configuration 41 [-]

AND

cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*

Configuration 42 [-]

AND

cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*

Configuration 43 [-]

AND

cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*

No data.

Project Subscriptions

Vendors	Products
Qualcomm Subscribe	Mdm9150 Subscribe Mdm9150 Firmware Subscribe Mdm9205 Subscribe Mdm9205 Firmware Subscribe Mdm9206 Subscribe Mdm9206 Firmware Subscribe Mdm9607 Subscribe Mdm9607 Firmware Subscribe Mdm9650 Subscribe Mdm9650 Firmware Subscribe Msm8909w Subscribe Msm8909w Firmware Subscribe Msm8996au Subscribe Msm8996au Firmware Subscribe Qcs404 Subscribe Qcs404 Firmware Subscribe Qcs605 Subscribe Qcs605 Firmware Subscribe Qualcomm 215 Subscribe Qualcomm 215 Firmware Subscribe Sd 205 Subscribe Sd 205 Firmware Subscribe Sd 210 Subscribe Sd 210 Firmware Subscribe Sd 212 Subscribe Sd 212 Firmware Subscribe Sd 410 Subscribe Sd 410 Firmware Subscribe Sd 412 Subscribe Sd 412 Firmware Subscribe Sd 425 Subscribe Sd 425 Firmware Subscribe Sd 427 Subscribe Sd 427 Firmware Subscribe Sd 429 Subscribe Sd 429 Firmware Subscribe Sd 430 Subscribe Sd 430 Firmware Subscribe Sd 435 Subscribe Sd 435 Firmware Subscribe Sd 439 Subscribe Sd 439 Firmware Subscribe Sd 450 Subscribe Sd 450 Firmware Subscribe Sd 625 Subscribe Sd 625 Firmware Subscribe Sd 632 Subscribe Sd 632 Firmware Subscribe Sd 636 Subscribe Sd 636 Firmware Subscribe Sd 650 Subscribe Sd 650 Firmware Subscribe Sd 652 Subscribe Sd 652 Firmware Subscribe Sd 670 Subscribe Sd 670 Firmware Subscribe Sd 710 Subscribe Sd 710 Firmware Subscribe Sd 712 Subscribe Sd 712 Firmware Subscribe Sd 820 Subscribe Sd 820 Firmware Subscribe Sd 820a Subscribe Sd 820a Firmware Subscribe Sd 835 Subscribe Sd 835 Firmware Subscribe Sd 845 Subscribe Sd 845 Firmware Subscribe Sd 850 Subscribe Sd 850 Firmware Subscribe Sd 855 Subscribe Sd 855 Firmware Subscribe Sd 8cx Subscribe Sd 8cx Firmware Subscribe Sda660 Subscribe Sda660 Firmware Subscribe Sdm439 Subscribe Sdm439 Firmware Subscribe Sdm630 Subscribe Sdm630 Firmware Subscribe Sdm660 Subscribe Sdm660 Firmware Subscribe Snapdragon High Med 2016 Subscribe Snapdragon High Med 2016 Firmware Subscribe Sxr1130 Subscribe Sxr1130 Firmware Subscribe

Advisories

Source	ID	Title
EUVD	EUVD-2019-11917	While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Fixes

Solution

No solution given by the vendor.

Workaround

No workaround given by the vendor.

References

Link	Providers
https://www.qualcomm.com/company/product-security/bulletins

History

No history.

Projects

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MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2019-11-06T17:11:25

Updated: 2024-08-04T18:42:51.125Z

Reserved: 2018-12-10T00:00:00

Link: CVE-2019-2275

Vulnrichment

No data.

NVD

Status : Modified

Published: 2019-11-06T17:15:13.410

Modified: 2024-11-21T04:40:35.850

Link: CVE-2019-2275

Redhat

No data.

OpenCVE Enrichment

No data.

Weaknesses

CWE-119

Attack Vector Local

Attack Complexity Low

Privileges Required Low

Scope Unchanged

Confidentiality Impact High

Integrity Impact None

Availability Impact None

User Interaction None

Access Vector Local

Access Complexity Low

Authentication None

Confidentiality Impact Partial

Integrity Impact None

Availability Impact None

Project Subscriptions

Projects

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